# Samsung wins contract to manufacture IBM Power11 processors

Samsung Electronics won a contract to manufacture IBM's next-generation Power11 server chipsets using its enhanced 7nm (7LPP) process and 2.5D ISC architecture packaging technology.

- Type: Contract
- Announced: 2025-09-19
- Where: South Korea
- Value: $6.60M (8.80B KRW)
- Status: announced
- Products: Power11 server chipsets, 7nm processors
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Samsung Electronics](https://endata.com/companies/647.md)
- [Samsung Electronics](https://endata.com/companies/647.md) (customer)
- [IBM](https://endata.com/companies/22500.md) (customer)
- [Exicon](https://endata.com/companies/25245.md) (supplier)

## Sources

- [samlover.com](https://samlover.com/2025/09/19/samsung-to-manufacture-ibms-next-gen-7nm-power11-processors/), 2025-09-20: "Samsung Electronics has now won the bid to produce the latest IBM Power11 server chipset, marking a crucial step forward in the Foundry segment."
- [marketin.edaily.co.kr](https://marketin.edaily.co.kr/News/ReadE?newsId=03148806642305040), 2025-09-29: "엑시콘(092870)은 삼성전자와 88억원 규모의 CLT INTERFACE BOARD 공급 계약을 체결했다고 29일 공시했다."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.