# LG and Flex to develop modular cooling solutions for data centres

LG Electronics has signed an MOU with Flex to develop integrated, modular cooling solutions for AI-era data centres.

- Type: Partnership
- Announced: 2025-08-29
- Status: announced
- Products: modular cooling solutions for data centres
- Sectors: [HVAC and Industrial Refrigeration](https://endata.com/sectors/hvac-refrigeration.md), [Electrical Equipment](https://endata.com/sectors/electrical-equipment.md)

## Companies

- [LG Electronics](https://endata.com/companies/11457.md) (partner)
- [Flex](https://endata.com/companies/12844.md) (partner)

## Sources

- [coolingpost.com](https://www.coolingpost.com/category/world-news/page/48/), 2025-08-29: "LG Electronics has signed an MOU with Flex, a US-based global manufacturer and innovator, to develop integrated, modular cooling solutions for AI-era data centres."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.