# Advanced Echem Materials, Nan Pao Resins and Trusval Technology form adhesive JV

Advanced Echem Materials, Nan Pao Resins Chemical and Trusval Technology announced a joint venture, Advanced Pao Trusval Technology, to produce high-performance adhesive materials for advanced chip packaging. The JV has initial capital of NT$500 million (US$16.35 million).

- Type: Partnership
- Announced: 2025-08-28
- Where: TWN
- Value: $16.4M (500.0M TWD)
- Status: announced
- Products: high-performance adhesive materials for advanced chip packaging
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md), [Specialty Chemicals](https://endata.com/sectors/specialty-chemicals.md)

## Companies

- [Advanced Pao Trusval Technology](https://endata.com/companies/86911.md)
- [Nan Pao Resins Chemical](https://endata.com/companies/29027.md) (partner)
- [Advanced Echem Materials](https://endata.com/companies/86909.md) (partner)
- [Trusval Technology](https://endata.com/companies/86910.md) (partner)

## Sources

- [taipeitimes.com](https://www.taipeitimes.com/News/biz/archives/2025/08/29/2003842845), 2025-08-28: "The new venture, Advanced Pao Trusval Technology Co, is expected to help strengthen the localization of key semiconductor material supply and enhance material self-sufficiency."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.