# Smiths Interconnect wins contract for AI chip test sockets

Smiths Interconnect announced that its DaVinci Gen V test sockets have been selected as the exclusive test socket solution by a major global provider of high-performance computing and AI semiconductor chips, supporting the customer's upcoming global launch of next-generation AI chips for data center GPU applications.

- Type: Contract
- Announced: 2025-08-26
- Status: announced
- Products: DaVinci Gen V test sockets, AI semiconductor chips, GPUs for data centers
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Smiths Group](https://endata.com/companies/11567.md) (partner)
- [Smiths Interconnect](https://endata.com/companies/24064.md) (supplier)

## Sources

- [smiths.com](https://www.smiths.com/news-and-insights/news/2025/smiths-interconnect-announces-significant-contract-win), 2025-08-26: "Our goal is to provide the fastest, most reliable test with the greatest precision, to meet the demands of semiconductor manufacturers in a fast-moving technological environment."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.