# HANMI Semiconductor invests 100 billion won in hybrid bonding technology

HANMI Semiconductor announced a 100 billion won investment to build a hybrid bonder factory in Incheon, South Korea, with completion targeted for the second half of 2026. The factory will produce next-generation equipment for HBM and AI packaging.

- Type: Investment
- Announced: 2025-07-25
- Where: Incheon Metropolitan City Ju-an National Industrial Complex, South Korea
- Value: $72.0M (100.0B KRW)
- Starts operating: Q3 2026
- Status: under construction
- Capacity: total floor area 14,570.84 m2
- Products: hybrid bonders, HBM TC bonders, fluxless bonders, big die TC bonders
- Sectors: [Semiconductors and Industrial Electronics](https://endata.com/sectors/semiconductors-electronics.md)

## Companies

- [Hanmi Semiconductor](https://endata.com/companies/22183.md)

## Sources

- [biz.chosun.com](https://biz.chosun.com/en/en-it/2025/07/25/RFPDUQTXRVDKBOPP6Z6WITDSNY/), 2025-07-25: "HANMI Semiconductor announced on the 25th that it will invest 100 billion won in hybrid bonding technology."
- [en.fnnews.com](https://en.fnnews.com/news/202507251012185768), 2025-07-25: "Hanmi Semiconductor is investing a total of 100 billion won in hybrid bonding technology."

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Data from Endata (https://endata.com/). Announcements are summarized from public sources and may be incomplete; check the linked originals.